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High performance SRAMs IN 1.5 V, 0.18μm partially depleted SOI technologyJOSHI, R. V; PELLELA, A; WAGNER, O et al.2002 symposium on VLSI circuits. 2002, pp 74-77, isbn 0-7803-7310-3, 4 p.Conference Paper

Adhesion enhancement of Cr/polyimide interfaces using RF pre-sputtering of polyimide surfacesOH, T. S; KOWALCZYK, S. P; HUNT, D. J et al.Journal of adhesion science and technology. 1990, Vol 4, Num 2, pp 119-129, issn 0169-4243Article

Surface modification of BPDA-PDA polyimideLEE, K.-W; KOWALCZYK, S. P; SHAW, J. M et al.Langmuir. 1991, Vol 7, Num 11, pp 2450-2453, issn 0743-7463Article

Molecular-beam-epitaxy GaAs regrowth with clean interfaces by arsenic passivationMILLER, D. L; CHEN, R. T; ELLIOTT, K et al.Journal of applied physics. 1985, Vol 57, Num 6, pp 1922-1927, issn 0021-8979Article

Hydrothermal stability of Cr/polyimide interfacesKIM, D. G; MOLIS, S. E; OH, T. S et al.Journal of adhesion science and technology. 1991, Vol 5, Num 7, pp 509-521, issn 0169-4243, 13 p.Article

Photoelectron spectroscopy studies of chemical vapor deposition of Ta from a TaF5 precursor on Si and SiO2 subtratesUGOLINI, D; KOWALCZYK, S. P; MCFEELY, F. R et al.Journal of applied physics. 1991, Vol 70, Num 7, pp 3899-3906, issn 0021-8979Article

Pthalimide on copper: a model system to address certain site-specific interactions at the polyimide-copper interfaceSALANECK, W. R; STAFSTROM, S; BREDAS, J.-L et al.Journal of vacuum science and technology. A. Vacuum, surfaces, and films. 1988, Vol 6, Num 6, pp 3134-3139, issn 0734-2101Article

CdTe-HgTe (111) heterojunction valence-band discontinuity: a common-anion-rule contradictionKOWALCZYK, S. P; CHEUNG, J. T; KRAUT, E. A et al.Physical review letters. 1986, Vol 56, Num 15, pp 1605-1608, issn 0031-9007Article

Growth of ODPA-APB polyimide films using molecular beam deposition, and their characterizationDIMITRAKOPOULOS, C. D; KOWALCZYK, S. P; KANG-WOOK LEE et al.Polymer (Guildford). 1995, Vol 36, Num 26, pp 4983-4990, issn 0032-3861Article

Low-temperature selective-area deposition of metals : chemical vapor deposition of gold from ethyl(trimethylphosphine)gold(I)BANASZAK HOLL, M. M; SEIDLER, P. F; KOWALCZYK, S. P et al.Applied physics letters. 1993, Vol 62, Num 13, pp 1475-1477, issn 0003-6951Article

Photochemical etching during ultraviolet photolytic deposition of metal films on semiconductor surfaces = Attaque photochimique pendant le dépôt photolytique en ultraviolet de couches minces métalliques sur des surfaces de semiconducteursKOWALCZYK, S. P; MILLER, D. L.Journal of applied physics. 1986, Vol 59, Num 1, pp 287-289, issn 0021-8979Article

Valence- and conduction-band structure of the sapphire (1102) surfaceGIGNAC, W. J; WILLIAMS, R. S; KOWALCZYK, S. P et al.Physical review. B, Condensed matter. 1985, Vol 32, Num 2, pp 1237-1247, issn 0163-1829Article

Semiconductor core-level to valence-band maximum binding-energy differences: precise determination by X-ray photoelectron spectroscopyKRAUT, E. A; GRANT, R. W; WALDROP, J. R et al.Physical review. B, Condensed matter. 1983, Vol 28, Num 4, pp 1965-1977, issn 0163-1829Article

X-ray photoelectron spectroscopic studies of chemical vapor deposition with TaF3 precursor on polyimide surfacesUGOLINI, D; KOWALCZYK, S. P; MCFEELY, F. R et al.Journal of applied physics. 1992, Vol 72, Num 10, pp 4912-4917, issn 0021-8979Article

A new correlation for Tc from Cu 2p absorptionRONAY, M; SANTONI, A; SCHROTT, A. G et al.Solid state communications. 1991, Vol 77, Num 9, pp 699-702, issn 0038-1098, 4 p.Article

Electronic structure of polyimide and related monomers : theory and experimentKOWALCZYK, S. P; STAFSTRÖM, S; BREDAS, J. L et al.Physical review. B, Condensed matter. 1990, Vol 41, Num 3, pp 1645-1656, issn 0163-1829Article

Adhesion and interface investigation of polyimide on metalsKIM, Y.-H; KIM, J; WALKER, G. F et al.Journal of adhesion science and technology. 1988, Vol 2, Num 2, pp 95-105, issn 0169-4243Article

Polyimide on copper: the role of solvent in the formation of copper precipitates = Polyimide sur cuivre: le rôle du solvant dans la formation de précipités de cuivreKOWALCZYK, S. P; KIM, Y.-H; WALKER, G. F et al.Applied physics letters. 1988, Vol 52, Num 5, pp 375-376, issn 0003-6951Article

A kinetic study of the mechanism of the solid-state reaction between pyromellitic dianhydride (PMDA) and oxydianiline (ODA)DIMITRAKOPOULOS, C. D; MACHLIN, E. S; KOWALCZYK, S. P et al.Macromolecules. 1996, Vol 29, Num 18, pp 5818-5825, issn 0024-9297Article

Near surface structure of solvent-free processed polyimide thin filmSARAF, R. F; DIMITRAKOPOULOS, C; TONEY, M. F et al.Langmuir. 1996, Vol 12, Num 11, pp 2802-2806, issn 0743-7463Article

Surface reactivity of alkylgold(I) complexes : substrate-selective chemical vapor deposition of gold from RAuP(CH3)3 (R = CH2CH3, CH3) at remarkably low temperaturesHOLL, M. M. B; SEIDLER, P. F; KOWALCZYK, S. P et al.Inorganic chemistry (Print). 1994, Vol 33, Num 3, pp 510-517, issn 0020-1669Article

Hydrothermal degradation of r.f. sputter-cleaned chromium-polyimide interfacesOH, T. S; KIM, D. G; KOWALCZYK, S. P et al.Journal of materials science letters. 1991, Vol 10, Num 7, pp 374-376, issn 0261-8028, 3 p.Article

Surface modification of PMDA-ODA polyimide : surface structure-adhesion relationshipKANG-WOOK LEE; KOWALCZYK, S. P; SHAW, J. M et al.Macromolecules. 1990, Vol 23, Num 7, pp 2097-2100, issn 0024-9297Article

Comparison of the selective adsorption and reactivity behavior of WF6 and TaF5 on SiO2 and polyimide surfacesMCFEELY, F. R; TERMINELLO, L. J; KOWALCZYK, S. P et al.Applied physics letters. 1990, Vol 57, Num 7, pp 667-669, issn 0003-6951Article

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